ENASE 2023 will be held in conjunction with ICEIS 2023.
Registration to ENASE allows free access to the ICEIS conference (as a non-speaker).
Although the conference is back to the normal mode (i.e., in-person) speakers are allowed to present remotely if unable to travel to the venue (hybrid support).
The mission of ENASE (Evaluation of Novel Approaches to Software Engineering) is to be a prime international forum to discuss and publish research findings and IT industry experiences with relation to novel approaches to software engineering. The conference acknowledges evolution in systems and software thinking due to contemporary shifts of computing paradigm to e-services, cloud computing, mobile connectivity, business processes, and societal participation. By publishing the latest research on novel approaches to software engineering and by evaluating them against systems and software quality criteria, ENASE conferences advance knowledge and research in software engineering, including and emphasizing service-oriented, business-process driven, and ubiquitous mobile computing. ENASE aims at identifying most hopeful trends and proposing new directions for consideration by researchers and practitioners involved in large-scale systems and software development, integration, deployment, delivery, maintenance and evolution.
Leszek Maciaszek, Institute of Business Informatics Wroclaw and Department of Computing Sydney, Macquarie Univ., Sydney, Australia and Wroclaw Univ. of Economics and Business, Poland
Hermann Kaindl, TU Wien, Univ. for Continuing Education Krems, Vienna Univ. of Economics and Business, AustriaMike Mannion, Computing, Glasgow Caledonian University, United Kingdom
Barbara Weber, University of St.Gallen, SwitzerlandLetizia Jaccheri, Norwegian University of Science and Technology, NorwayRobert Winter, Institute of Information Management, University of St. Gallen, Switzerland
Publications:
It is planned to publish a short list of revised and
extended versions of presented papers with
Springer in a CCIS Series book
Technically co-sponsored by:
Proceedings will be submitted for evaluation for indexing by: