ENASE 2024 will be held in conjunction with ICEIS 2024 and ICT4AWE 2024.
Registration to ENASE allows free access to the ICEIS and ICT4AWE conferences (as a non-speaker).
Although the conference is back to the normal mode (i.e., in-person) speakers are allowed to present remotely if unable to travel to the venue (hybrid support).
Upcoming Submission Deadlines
Regular Paper Submission:
December 13, 2023
Position Paper Submission:
January 25, 2024
Doctoral Consortium Paper Submission:
February 29, 2024
(See Important Dates for more information)
The mission of ENASE (Evaluation of Novel Approaches to Software Engineering) is to be a prime international forum to discuss and publish research findings and IT industry experiences with relation to novel approaches to software engineering. The conference acknowledges evolution in systems and software thinking due to contemporary shifts of computing paradigm to e-services, cloud computing, mobile connectivity, business processes, and societal participation. By publishing the latest research on novel approaches to software engineering and by evaluating them against systems and software quality criteria, ENASE conferences advance knowledge and research in software engineering, including and emphasizing service-oriented, business-process driven, and ubiquitous mobile computing. ENASE aims at identifying most hopeful trends and proposing new directions for consideration by researchers and practitioners involved in large-scale systems and software development, integration, deployment, delivery, maintenance and evolution.
Leszek Maciaszek, Macquarie Univ., Sydney, Australia and Wroclaw Univ. of Economics and Business, Poland
Hermann Kaindl, TU Wien, Univ. for Continuing Education Krems, Vienna Univ. of Economics and Business, AustriaMike Mannion, Glasgow Caledonian University, United Kingdom
Giancarlo Guizzardi, University of Twente, Netherlands
Publications:
It is planned to publish a short list of revised and
extended versions of presented papers with
Springer in a CCIS Series book (final approval pending)
Technically co-sponsored by:
Proceedings will be submitted for evaluation for indexing by: